FPGA可编程逻辑器件芯片EP1SGX40DF1020中文规格书

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摘要:However,thereisadditionalresistancepresentbetweenthedeviceballandtheinputofthereceiverbuffer,asshowninFigure1.Thisresistanceisbecauseofpackagetraceresistance(whichcanbecalculatedastheresistancefromthepackageballtothepad)andtheparasiticlayoutmetalroutingresistance(whichisshownbetweenthepadandtheintersectionoftheon-chipterminationandinputbuffer).Figure115.DifferentialResistanceofLVDSDifferentialPinPair(RD)PadPackageBall0.3Ω9.3Ω0.3Ω9.3ΩLVDSInputBufferRDPackageBallDifferentialOn-ChipTerminationResistorPadTable52definesthespecificationforinternalterminationresistanceforcommercialdevices.Table52.DifferentialOn-ChipTerminationResistanceSymbolRD(2)DescriptionInternaldifferentialterminati

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