FPGA可编程逻辑器件芯片XC7Z045-1FFG900I-XC7Z045-1FFG900C中文规格书
摘要:RevisionHistoryThefollowingtableshowstherevisionhistoryforthisdocument.DateVersion06/22/20181.8.103/14/20181.8RevisionEditorialupdatesonly.Notechnicalcontentupdates.InChapter1:RevisedRSVDGNDdescriptioninTable1-5.InChapter2:UpdatedlinksinTable2-1.InChapter4:InresponsetoXCN16004:ForgedtoStampedLidConversionforMonolithicFPGAFlipChipPackages,addedFigure4-13:FFG900(XC7Z035,XC7Z045,andXC7Z100)Flip-ChipBGAwithStampedLidPackageSpecifications.06/14/20171.7AddedtheXC7Z007S,XC7Z012S,andXC7Z014Sdeviceswhereapplicable.InChapter5:UpdatedthepackagesandPeakPackageReflowBodyTemperature.OtherupdatestotheSupportforThermalModels,AppliedPressurefromHeatSinktothePackageviaThermalInterfaceMaterials,and
温馨提示：当前文档最多只能预览
5 页，若文档总页数超出了
5 页，请下载原文档以浏览全部内容。
本文档由 匿名用户 于 2020-07-08 10:10:01上传分享
