MEMORY存储芯片XQ7Z100-2RF900I中文规格书
摘要:Chapter5:ThermalSpecifications•HeatSinkingSolutionsattheSystemLevelDependingonthesystem’sphysicalaswellasmechanicalconstraints,theexpectationisthatthethermalbudgetwillbemaintainedwithcustomorOEMheatsinksolutions,providingthethirdpronginthethermalmanagementstrategy.Atthispoint,Xilinxhaslefttheheatsinksolutiontothesystemleveldesignerswhocantailorthedesignandsolutiontotheconstraintsoftheirsystems,beingfullyawarethattheparthascertaininherentcapabilitiesfordeliveringtheheattothesurface.TheVirtex-4FPGApackagescanbegroupedintomedium-andhigh-performancepackagesbasedontheirpowerhandlingcapabilities.AllVirtex-4FPGApackagescanusethermalenhancements,rangingfromsimpleairflowtoschemesthatcanin
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